Total System Approach to Power and Area Optimization for a Wired Communications Device

Jim Wieser
National Semiconductor

Broadband communications on copper wires continues to increase in speed and application. The target is to offer higher speeds at close to the same cost of prior technologies. This requires careful focus on both power and die area to achieve low system cost and allow high density switches. A case study of such a device will be presented which addresses all aspects of the chip system to reduce cost including: signal processing architecture, analog circuit designs and DSP implementation. Demonstration of reductions in power and area by 1/4 without changing process technology is possible.