Main Processing Board, 26 Layer PCB, 4 Mil Trace, 53 cm by 58 cm, 155 Mil Thick.
Main Processing Board connected with Power Board, and Power Supply Module.
Back of the Main Processing Board.
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Main Processing Board, 26 Layer PCB, 4 Mil Trace, 53 cm by 58 cm, 155 Mil Thick.
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Main Processing Board connected with Power Board, and Power Supply Module.
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Back of the Main Processing Board. |
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Wireless Research Center, University of California, Berkeley, all rights
reserved. |