PicoNode 2 (TCI) Subgroup
Contact Point: Mike Sheets
Meetings: meetings on demand

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Chipset wins 2nd place in DAC 2003 
Student Design Contest (operational category)

Read the paper


PicoNode2 Subgroup: Mission

TCI focuses on an architectural implementation methodology for wireless protocols. We use the functionality specified for the Intercom Board, as our driver application (see previous research by Jan Rabaey). This methodology has to be broad enough to be used in future designs, such as PicoNode3.

The Intercom is composed of a Protocol Stack and a Physical Layer, which are designed in different environments due to their differences in nature. In  the architectural exploration phase, we are using VCC for the former and Simulink for the latter.

This phase of the project is now complete.


PicoNode2 Subgroup: History

  • 6/1/03 - TCI chipset - Awarded 2nd Place in DAC student design contest (operational category)

  • 6/1/02 - TCI chipset - Chips tested and shown to work in lab

  • 12/7/01 - Wireless protocol processor (WPP) chip - back from fab waiting for test board

  • 12/7/01 - Baseband processor (BBP) chip - in foundry

  • 12/7/01 - Printed circuit board - at manufacturer


PicoNode2 Subgroup: People

Champion:

Mike Sheets msheets@eecs.berkeley.edu Subgroup Leader
Faculty: Jan Rabaey jan@eecs.berkeley.edu Advisor
Staff: Fred Burghardt flb@eecs.berkeley.edu Test-bed/applications
Mika Kuulusa mkuulusa@bwrc.eecs.berkeley.edu System integration
Students: Josie Ammer mjammer@eecs.berkeley.edu Baseband processor chip
Suet-Fei Li suetfei@eecs.berkeley.edu System OS
Mike Sheets msheets@eecs.berkeley.edu Protocol processor chip
Huifang Qin huifangq@bwrc.eecs.berkeley.edu Back-end design flow

PicoNode2 Subgroup: Implementation


Last Update: 09/29/03 02:08:03 PM
Please direct question or comments to msheets@eecs.berkeley.edu