Two-Chip Intercom

Protocol Stack

• Protocol                       sdl.ps
• Layers description      layers.doc
• Design Flow                 df.ppt
  (presented at PicoRadio meeting)

Physical Layer

• Physical Layer (Stateflow-Simulink)   How to open the simulation.
• Presentations and Documentation

Class projects

• Power Study of a TDMA Protocol in Wireless Communication Systems
• Protocol Implementation in Reconfigurable Hardware
• Microprocessor Optimization for Network Protocol Implementations
• Verification of TCI using Mocha

Posters presented at Winter Retreat - 01/2000:

• uIntercom Board
• Two Chip Intercom Driver 
• A Protocol Design Methodology
• Physical Layer Methodology
• Architecture Performance Models
• Architectural Exploration
• Cosimulation with SDL and MATLAB

Presentations in TCI meetings:

• MAXSIM System Level Simulator (Feb. 01 2000)
• Formal Verification: Work done in 1999 (Feb. 15 2000)
• Formal Verification: Proposal for 2000 (Feb. 15 2000)
• Physical Layer (Feb. 22 2000)
• SF2VHD and VCC Links (Mar. 07 2000)
• FPGA/PLD results (Mar. 07 2000)
• Std. Cell results (Mar. 14 2000)
• Communication Refinement for TCI (Mar. 14 2000)
• Tensilica performance model (Mar. 14 2000)
• Planning Meeting (Mar. 21 2000)

Local Access:

• Unicad Flow
• Meeting Minutes
• Implementation Details
• Cadence Physical Design Flow